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Second Laser Machine - List of Manufacturers, Suppliers, Companies and Products

Second Laser Machine Product List

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Femtosecond laser processing machine LaserStation(TM)

Introduced a processing machine equipped with IFRIT (Ifrit) from Cyber Laser Co. It enables high-precision micro-machining of difficult-to-process materials and achieves reduced friction.

Femtosecond lasers are cutting-edge technology that enables precise processing without the involvement of heat through a multiphoton absorption process. We provide high-stability, high-quality femtosecond lasers, including the IFRIT from Cyber Laser, which can be introduced not only for research purposes but also into actual production environments. We can repeatedly create V-grooves with high reproducibility. Additionally, we can process not only semiconductor substrates but also LSI chips, RFIDs, sapphire substrates for LEDs, and glass substrates for FPDs. We will perform precision processing of prototype parts and samples faster than anyone else! If you are facing issues with delivery times or accuracy, please feel free to consult us. For more details, please download the catalog or contact us.

  • Circuit board processing machine
  • Other processing machines
  • Processing Contract

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Picosecond laser processing machine

Improving roundness and cylindrical accuracy! Introduction of high-quality, high-energy pulse laser precision processing machines.

We would like to introduce the "Picosecond Laser Processing Machine" that we handle. With picosecond pulse lasers, high-precision processing of metals is possible. Our uniquely designed optical system allows for straight hole processing and simultaneous multi-branch processing. It supports correction processing for roundness and cylindricity when combined with the ultra-high precision measuring instrument "UA3P-L." 【Features】 - Achieves high-precision processing with minimal thermal impact and piezo scanning. - Scans laser light using a 4-axis piezo system. - Capable of processing tapered and reverse tapered shapes, as well as a variety of hole shapes. - Feedbacks measurement data from the 3D measuring machine "UA3P-L" into processing data. - Divides laser light using diffractive optical elements (DOE). - Increases productivity through simultaneous multi-branch processing. *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Laser marker

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